Processing information

Important tips for handling our products

The following processing instructions are general tips and apply to a large part of our standard range. However, as there are of course some exceptions, you should always follow the product-specific application instructions. If you are missing the relevant information, we will be happy to help you.

Abrasion resistance

  • To achieve optimum adhesion, the substrates to be bonded must be clean, dry and free of grease.
  • Anti-adhesive surface substances such as dust, mold release agents, greases or waxes must be removed before bonding.
  • If possible, ensure that the substrate is free of plasticizers.


  • For rough and uneven substrates, use thicker, leveling adhesive tapes.


  • The optimum bonding temperature is between 20 and 30°C in dry rooms. If possible, do not work at temperatures below 10°C


  • The separator cover must be completely removed.
  • After joining, press the workpieces together with sufficient and uniform contact pressure (approx. 20 N/cm²).
  • For optimum bonding, use a pressure roller.
  • Ensure that processing equipment (including hands) is free of release agents.

Final adhesive strength

  • To achieve the generally higher final adhesive strength, a mounting time of up to 48 hours is necessary.


  • Store the tape in its original packaging at room temperature (optimum: 18°C and 55% relative humidity).