Tips for Use
Important Processing Instructions for Handling Our Products
The following processing instructions are general tips and apply to a large part of our standard range. However, as there are of course some exceptions, you should always follow the product-specific application instructions. If you are missing the relevant information, we will be happy to help you.
Application
- The separator cover must be completely removed.
- After joining, press the workpieces together with sufficient and uniform contact pressure (approx. 20 N/cm²).
- For optimum bonding, use a pressure roller.
- Make sure to use release agent-free application equipment (this also applies to your hands).
Abrasion resistance
- To achieve optimum adhesion, the substrates to be bonded must be clean, dry and free of grease.
- Anti-adhesive substances on the surface, such as dust, mold release agents, greases, or waxes, must be removed before bonding.
- If possible, ensure that the substrate is free of plasticizers.
Final adhesive strength
To achieve the generally higher final adhesive strength, a mounting time of up to 48 hours is necessary.
Storage
Store the adhesive tape in its original packaging at room temperature (ideally: 18 °C and 55% relative humidity).
Temperature
The optimal bonding temperature is between 20 and 30 °C in dry rooms. Whenever possible, avoid working at temperatures below 10 °C.
Unevenness
For rough and uneven substrates, use thicker, leveling adhesive tapes.